GPU/HBM Packaging Resilience
Model allocation shortfall and lead‑time risk across advanced packaging—Chip‑on‑Wafer‑on‑Substrate (CoWoS), Foveros, EMIB—and High Bandwidth Memory (HBM). Plan mitigations with prepay, second‑source, supplier‑mix, and schedule policy.
KPIs
Resilience Index
Composite index (0–1) summarizing packaging resilience across supplier concentration, yields, utilization, secured shares, and governance controls.
Higher is better
Allocation Shortfall (%)
Gap between requested and supplier‑confirmed allocation for the planning window.
Higher is worse
Capacity Realization (%)
Delivered accelerators as a share of plan for the period.
Higher is better
Delivery Slippage (Days)
Average days late vs planned ship/need dates for allocated batches.
Higher is worse
Allocation Probability
Modeled probability (0–1) of receiving requested GPU/HBM allocations within the requested window.
Higher is better
Internal Factors
Supplier Concentration (HHI 0–1)
Herfindahl‑Hirschman Index over effective suppliers across HBM, substrates, and OSAT tiers.
Higher is worse
Export Controls Risk Index
Exposure (0–1) to export controls/sanctions by node, package, supplier geography, and destination mix.
Higher is worse
Packaging Yield (%)
Yield for the selected advanced‑packaging flow at the program’s node/design; include rework if applicable.
Higher is better
OSAT Utilization (%)
Weighted utilization of relevant outsourced assembly/test lines; higher values imply less slack.
Higher is worse
Advanced Packaging Capacity
Effective AP capacity available to the program after reservations and yield effects (monthly series).
Higher is better
Secured Packaging Capacity Share (%)
Share of total advanced‑packaging capacity secured via contracts/allocations for the period.
Higher is better
Substrate Capacity (msqm)
Available ABF substrate capacity (thousand square meters) addressable for the program (monthly series).
Higher is better
Memory Wafer Demand
Implied HBM wafer demand from program builds and memory configs (monthly series).
Higher is worse
Accelerator Demand
Program’s accelerator unit demand (quarterly series).
Higher is worse
Accelerator Lead Time (Days)
Quoted lead time from confirmed PO to shipment readiness for accelerators.
Higher is worse
Memory Lead Time (Days)
Quoted lead time from PO to RTS for HBM components.
Higher is worse
Levers
Advanced Packaging Technology
Selected packaging flow (e.g., CoWoS, Foveros, EMIB, InFO, SiP).
Prepay Commitment (USD)
Program prepayment/LOA committed to secure HBM and packaging capacity.
Higher is better
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USD (millions)
Second‑Source Budget (USD)
Budgeted spend to qualify and ramp alternate suppliers across critical tiers.
Higher is better
Obfuscated preview — sign in to view exact values
USD (millions)
Supplier Diversity Target (%)
Target share mix across suppliers for critical tiers; higher values indicate greater diversification.
Higher is better
Delivery Window Flex (Days)
Program‑offered shipment window flexibility for suppliers (monotone good for allocation/slotting).
Higher is better
Schedule Buffer (Days)
Internal buffer added to need dates to absorb supply variability.
Higher is better